1. D-H. Kim, J-J. Kim, J-H. Ha, Method of forming a conductive layer and an electroplating apparatus there of, 6372116, (2002.04.16).

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2. D-H. Kim, C.R. Kim, Synthesizing method of supply gas for forming CVD thin film, 10-0232195, (1999.09.03).

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3. D-H. Kim, Thin film forming method using chemical vapor deposition system, 10-0226764, (1999.07.29).

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4. D-H. Kim, Process for forming interconnector of semiconductor device, 10-0214526, (1999.05.20).

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5. D-H. Kim, Structure of interconnection and process for the same, 10-0205301, (1999.04.02).

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6. D-H. Kim, Y. H. Kim, 10-0172857, (1998.10.26).

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7. D-H. Kim, S. S. Chun, J. U. Park, D. W. Kim, S. G. La, S. Y. Lee, W. J. Lee, Method of forming thin film with diffusion barrier characteristics, 10-0166857, (1998.09.24).

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8. Y. G. Jun, D-H. Kim, A method for forming barrier metal layer of semiconductor device, 10-0166844, (1998.09.24).

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9. Y. J. Lee, D-H. Kim, Method of fabricating metal wire of semiconductor device, 10-0161883, (1998.08.26).

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10. D-H. Kim, Method of fabricating metal line structure, 5795796, (1998.08.18).

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11. D-H. Kim, Method of fabricating metal structure, 2789332, (1998.06.12).

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12. D-H. Kim, Formation of ZrN coating using CVD, 19735990, (1998.02.06).

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13. D-H. Kim, Formation of TiN coating using CVD, 19732432, (1998.02.05).

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