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1. D-H. Kim, J-J. Kim, J-H. Ha, Method of forming a conductive layer and an electroplating apparatus there of, 6372116, (2002.04.16).
2. D-H. Kim, C.R. Kim, Synthesizing method of supply gas for forming CVD thin film, 10-0232195, (1999.09.03).
3. D-H. Kim, Thin film forming method using chemical vapor deposition system, 10-0226764, (1999.07.29).
4. D-H. Kim, Process for forming interconnector of semiconductor device, 10-0214526, (1999.05.20).
5. D-H. Kim, Structure of interconnection and process for the same, 10-0205301, (1999.04.02).
6. D-H. Kim, Y. H. Kim, 10-0172857, (1998.10.26).
7. D-H. Kim, S. S. Chun, J. U. Park, D. W. Kim, S. G. La, S. Y. Lee, W. J. Lee, Method of forming thin film with diffusion barrier characteristics, 10-0166857, (1998.09.24).
8. Y. G. Jun, D-H. Kim, A method for forming barrier metal layer of semiconductor device, 10-0166844, (1998.09.24).
9. Y. J. Lee, D-H. Kim, Method of fabricating metal wire of semiconductor device, 10-0161883, (1998.08.26).
10. D-H. Kim, Method of fabricating metal line structure, 5795796, (1998.08.18).
11. D-H. Kim, Method of fabricating metal structure, 2789332, (1998.06.12).
12. D-H. Kim, Formation of ZrN coating using CVD, 19735990, (1998.02.06).
13. D-H. Kim, Formation of TiN coating using CVD, 19732432, (1998.02.05).


1. D-H. Kim,  Manufacturing method of titanium oxide using chemical vapor deposition, 10-2004-61819, (2004.08.05).
2. D-H. Kim, Manufacturing method of titanium oxide film, 10-2004-61821, (2004.08.05).
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